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Location: Home>Papers of Analysis and Testing Technology and Instruments |
| Checking and Maintenance of HV Troubleshooting in Tecnai G20 TEM |
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ZHANG Feng, ZHUGE Lan-jian, GAO Wei-jian (Analysis and Testing Center, Soochow University, Suzhou 215123,China) Abstract: The checking and removal methods for the HV troubleshooting caused by SF6 decomposition, and some experiences in daily maintenance on Tecnai G20 TEM are introduced. Key words:TEM; HV; troubleshooting E-mail: ylfengzhang@suda.edu.cn Analysis and Testing Technology and Instruments, Vol. 18, No. 3, 2012,194-195 |