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Location: Home>Papers of Analysis and Testing Technology and Instruments
Checking and Maintenance of HV Troubleshooting in Tecnai G20 TEM
2012-09-28 ArticleSource:
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ZHANG Feng, ZHUGE Lan-jian, GAO Wei-jian

(Analysis and Testing Center, Soochow University, Suzhou 215123,China)

Abstract: The checking and removal methods for the HV troubleshooting caused by SF6 decomposition, and some experiences in daily maintenance on Tecnai G20 TEM are introduced.

Key words:TEM; HV; troubleshooting

E-mail: ylfengzhang@suda.edu.cn

Analysis and Testing Technology and Instruments, Vol. 18, No. 3, 2012,194-195

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